Transphorm and Weltrend Launch New System-in-Package Powering Next-Gen USB-C Adapters

In a groundbreaking development for power adapter technology, Transphorm, Inc., a prominent name in GaN power semiconductors, has joined forces with Weltrend Semiconductor Inc., a leader in USB Power Delivery Controller ICs, to release a 100-watt USB-C PD Power Adapter Reference Design. This innovative design is energized by their SuperGaN® System-in-Package (SiP)—identified as the WT7162RHUG24A—to deliver an exceptional 92.7 percent efficiency, setting a new bar for power efficiency in a Quasi-Resonant Flyback (QRF) topology.

This unveiling marks Weltrend’s second venture utilizing the WT7162RHUG24A SiP in a QRF topology, with its first being a 65-watt board launched earlier in the year. The capacity for the same GaN SiP to serve dual power levels of 65 watts and 100 watts is a strategic advantage for customers aiming to scale production and reduce costs in the competitive 100-watt design space. The robustness and performance of the 65-watt-class SuperGaN SiP, now proven to meet the rigorous demands of 100-watt applications, underscores the adaptability and potential economies of scale that this technology offers.

Philip Zuk, Senior Vice President of Business Development and Marketing at Transphorm, emphasizes the significant strides made in integrated circuit design, stating, “The idea of a GaN-based integrated circuit is a great one as it can simplify the design experience. However, it must be done right. It should be a truly integrated single device with the necessary controllers packaged inside. Which is where Weltrend and Transphorm’s SuperGaN SiP excels.” He points out the SiP as a straightforward, normally-off solution that operates without the need for additional protection, drivers, or external controllers, showcasing its simplicity and efficacy.

Moreover, Wayne Lo, Vice President of Marketing at Weltrend Semiconductor, discusses the company's dedication to market leadership through functional and superior solutions, particularly in the AC-to-DC power sector. "The power adapter market continues to evolve, innovating around GaN's very attractive advantages. We’re just making sure customers can tap into those advantages not just for technical benefit but for broad ROI benefit as well," he says. Lo describes the SiP's dual capability to meet both the design needs of physical adapters and the financial goals of varying adapter models, highlighting the comprehensive benefits this technology brings to the market.

The prowess of the SuperGaN SiP is detailed through its specifications, delivering a full load efficiency rated at 91.2% at 90 VAC and an overall peak efficiency of 92.7% at 264 VAC. Its remarkable power density is calculated at 15.8 W/in³ (without housing), and the operational voltage range is extensive, from 3.3 V up to 21 V through USB-C PD 3.0. It supports a range of output voltage and current settings, including PPS: 3.3 V – 21 V/5 A, and several others, to accommodate diverse power needs. Furthermore, the SiP's dimensions of 69mm by 63mm by 23.8mm speak to its compact design, crucial for the development of sleek, modern adapters.

The SuperGaN SiP's energy-saving prowess is further accentuated by its minimal no-load power loss, which is less than 50 mW at 264 VAC. The stringent EMI compliance for both conducted and radiated emissions ensures it aligns with rigorous industry standards. These features collectively point to a forward-thinking approach in semiconductor design that prioritizes both efficiency and practicality.

The strategic alliance between Transphorm and Weltrend Semiconductor has culminated in a robust 100-watt adapter design that not only demonstrates the companies' technological innovation but also promises a tangible return on investment. By delivering a solution that marries performance with cost efficiency, the SuperGaN SiP WT7162RHUG24A is positioned to transform the efficiency and versatility of power adapters across the global market, with implications that extend to enhancing the sustainability and convenience of powering tomorrow's smart devices.